Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration – Vide Leaf

Prime Archives in Sensors: 2nd Edition

Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole ConfigurationDownload

Substrateless-Packaging-for-a-D-Band-MMIC-Based-on-a-Waveguide-with-a-Glide-Symmetric-EBG-Hole-Configuration